电镀溶液中铜离子的测定 应用资料

电镀溶液中铜离子的测定 应用资料在微酸性条件下，试样中加入的适量碘化钾与二价铜作用，析出等当量的碘。用硫代硫酸钠标准滴定溶液滴定析出的碘。使用0.1mol/L硫代硫酸钠滴定至终点，以测量电镀溶液中的铜离子。终点是滴定曲线上的最大拐点。根据硫代硫酸钠的滴定体积计算铜离子的浓度。KGM KYOTO ELECTRONICSMANUFACTURING CO.，LTD.TIQ-99001enL Application MemoCopper Ion in Plating Solution Industry Inorganic chemical industry Instrument Automatic potentiometric titrator Measurement method Redox titration Standards HG/T 3592 1.Overview When potassium iodide is added to diluted acetic acid of Cu， CuI precipitates where freeiodine is obtained. Titrate the iodine with sodium thiosulfate to quantify copper (Cu²) in thesolution. In this reaction， copper (Cu?t) works as univalent oxidant as below： 1mol Cu²+=1/2molI2=1mol Na2S2O3 Following the above preprocess， titration goes on to the endpoint with 0.1mol/L sodiumthiosulfate in order to measure copper ion in plating solution. The endpoint is the maximuminflexion on the titration curve. The concentration of copper ion is calculated from the titrationvolume of sodium thiosulfate. 2. Apparatus Main unit Automatic potentiometric titrator (preamplifier STD)Electrode Platinum electrodeCeramic reference electrode 3.Reagents Titrant 0.1mo1/L sodium thiosulfate solutionSolvent Pure waterAdditive Acetic acid， 10% ammonium acetate， Potassium iodide (powder) —Measurement results S一 Sample Titer Copper ion (mL) (mL) (g/L) 1 2.0 5.3705 17.06 2 2.0 5.3729 17.07 3 2.0 5.3654 17.05 Average 17.06 SD 0.012 RSD(%) 0.072 —Titration curve— Please feel free to contact us for any further information. Kyoto Electronics Manufacturing Co.， Ltd. Overseas Sales & Marketing Sect. 京都电子工业株式会社-可睦电子(上海)商贸有限公司 上海市徐汇区宜山路333号1201室 电话：021-54488867 电邮： kemu-kem@163.com 网址： http：//www.kem-china.com