硫酸铜电镀溶液中硫酸含量的测定 应用资料

硫酸铜电镀溶液中硫酸含量的测定 应用资料基于酸碱滴定。硫酸铜电镀液的硫酸是样品加水后，用1mol/L氢氧化钠滴定溶液滴定。终点是滴定曲线上的最大拐点。硫酸的浓度由氢氧化钠的滴定体积计算。KGMKYOTO ELECTRONICSMANUFACTURING CO.，LTD.TIO-93022enL Application Memo Sulfuric Acid in Copper Sulfate Plating Solution 1.Overview Sulfuric acid of copper sulfate plating solution is measured by titration with 1mol/L sodium hydroxide after the sample i s added with water. The endpoint i s the maximum inf l exion on the t it r at i on curve. The concentration of sulfuric acid is calculated from the titration volume of sodium hydroxide. 2. Apparatus Main unit Automatic potentiometric t itrator (preampli f ier： STD) Electrode pH glass electrode Ceramic reference electrode 3. Reagents Titrant 1 mo1/L sodium hydroxide (f =1.004) Solvent Pure water 4. Example Sample Titer Sulfuric acid(mL) (mL) (g/L) 1 5.0 19.6360 193.2 —Measurement results一 32.0 精止源定 业 一 家 —Titration curve— Please feel free to contact us for any further information. Kyoto Electronics Manufacturing Co.， Ltd. Overseas Sales & Marketing Sect. 京都电子工业株式会社-可睦电子(上海)商贸有限公司 上海市徐汇区宜山路333号1201室 电话： 021-54488867 电邮： kemu-kem@163.com 网址： http：//www.kem-china.com