电镀溶液中过氧化氢的测定 应用资料

电镀溶液中过氧化氢的测定 应用资料在样品中加入纯水和硫酸(1+1)后，用0.02mol/L高锰酸钾滴定溶液至终点，测量电镀溶液中的过氧化氢含量。终点是滴定曲线上的最大拐点。过氧化氢浓度由高锰酸钾滴定溶液的滴定体积计算得出。KGM KYOTO ELECTRONICSMANUFACTURING CO.，LTD.TIO-93002enL Application Memo Hydrogen Peroxide in Plating Solution 1.Overview Hydrogen peroxide i n plating solution i s measured by t itration up to the endpoint with 0.02mol/L potassium permanganate after adding pure water and sulfuric acid (1+1) to the sample. The endpoint is the maximum inflexion on the t i tration curve. The hydrogen peroxide concentration is calculated from titration volume of potassium permanganate. 2. Apparatus Main unit Automatic potentiometric titrator (preampli f ier STD) Electrode Platinum electrode Ceramic reference electrode 3. Reagents Titrant 0.02mo1/L(0.1N) potassium permanganate (f =1.006)Solvent Pure water， Sulfuric acid (1+1) 4. Example Please feel free to contact us for any further information. Kyoto Electronics Manufacturing Co.， Ltd. Overseas Sales & Marketing Sect. 京都电子工业株式会社-可睦电子(上海)商贸有限公 司 上海市徐汇区宜山路333号1201室 电话：021-54488867 电邮： kemu-kem@163.com 网址： http：//www.kem-china.com