法国Annealsys 高温退火炉AS-ONE
Versatile Rapid Thermal Processing system for silicon, compound semiconductors, solar cells & MEMS 多用途快速热处理设备,适用于硅,化合物半导体,太阳能电池& MEMS
Up to 1450°C (100HT version), up to 200°C/s, high vacuum capability, fast cooling option 最高温度到1450℃(100HT版本), 升温速率最大200℃/s, 高真空性能,快速冷却选项
Applications 应用
. Implant annealing 注入退火
. Ohmic contact annealing (III-V and SiC) 欧姆接触退火(III-V 和SiC)
. Rapid Thermal Oxidation (RTO) 快速热氧化(RTO)
. Rapid Thermal Nitridation (RTN) 快速热氮化 (RTN)
. Selenization (CIGS solar cells) 硒化(CIGS太阳能电池)
. CVD of graphene 石墨烯CVD
. Silicon carbonization 碳化硅
. Sol-gel densification and crystallization 溶胶凝胶致密性和结晶化
. Diffusion from spin-on dopants 从旋涂掺杂物扩散
.Etc. 等等
Substrate types 基片类型
• Silicon wafers硅片
• Compound semiconductor wafers化合物半导体基片
• GaN/Sapphire wafers for LEDs 用于LED的GaN/蓝宝石基片
• Silicon carbide wafers碳化硅基片
• Poly silicon wafers for solar cells用于太阳能电池的多晶硅基片
• Glass substrates玻璃基片
• Metals金属
• Polymers聚合物
• Graphite and silicon carbide susceptors石墨和镀碳化硅的石墨基片托
• Etc等等
Key Features 主要特性
• Infrared halogen tubular lamp furnace with silent fan cooling •配有无声风扇冷却的红外卤素管灯退火炉
• Stainless steel cold wall chamber technology •不锈钢冷壁腔室技术
• Fast digital PID temperature controller •快速数字PID温度控制器
• Thermocouple and pyrometer control •热电偶和高温计控制
• Atmospheric and vacuum process capability •常压和真空下工艺性能
• Purge gas line with needle valve •配有针阀的吹扫气路
• Up to 5 process gas lines with digital MFC •最多5路工艺气路配有数字MFC控制器
• PC control with Ethernet communication for fast data logging •配有以太网通讯的PC控制,用于快速数据记录
• Optional turbo pump and pressure control •可选分子泵和压力控制
Floor standing system for reduced footprint 减少占地空间的立式设备
![](https://img1.17img.cn/17img/images/202307/uepic/c14647cb-a4bb-4223-aa82-a7fc81bb090c.jpg)