牛津仪器X-MaxTEM大面积硅漂移探测器

Introduction Application Note As semiconductor devices continue to decrease in size to improve performance and take advantage of advances in fabrication techniques, there is a need to analyse both their structure and chemistry at ever increasing resolution. Typically this requires the use of TEM for metrology and failure analysis. Using ultrahigh resolution FEG-SEM, low kV imaging and the new X-Max® Extreme EDS detector we demonstrate the ability to retain some of this high resolution analysis in the SEM. This allows for better targeting of resources and increased throughput of analysis.

For many materials, the truly important is how they perform and behave under the conditions that they are likely to be exposed to during their use-lifetime. This may be the application of stresses and strains in construction materials, the dielectric properties of ceramics or the corrosion resistance of materials as they are exposed to a variety of atmospheric conditions.

Metals alloys and ceramics have a place in almost all of global manufacturing. Whether it is the turbine blades in a jet engine, the ceramic brake pads on a sports car or the steel cables for a suspension bridge, understanding the composition and structure of these materials is critical in understanding their properties.

The economic viability of a mine can be determined by the microscopic characteristics of the ore, including the mineral abundance, the grain size and the degree of ore mineral liberation.