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DBT1000 | DBT-1200 | ||||
Speci? cations: Die size: from 300x300μm Thickness: from 3 mil and up 2 basic con? gurations: ? Modul I : XYZ and Theta for Chip handling ? Modul II : XYZ, hi resolution, for multi chuck Shuttle and pin Test centering Z motion with adjustable angle
Pickup Tool offset to Crosshair: programmable Test Pin to crosshair: programmable Joystick: proportionnal speed Chip hold on chuck by vacuum Two LCD display, used for wafer handling and for Test Monitoring. Video Target generator for alignment. Lights: Direct and pen LED lights. | Speci?cations: Die size: from 250x250μm (10mil) Thickness: from 75μm, (3 mil) and up 2 basic con? gurations: ? Modul I : XYZ and Theta for Chip handling, ? Modul II : XYZ, hi resolution, for multi chuck Shuttle and pin Test centering Z motion with adjustable angle Pickup Tool offset to Crosshair: programmable Test Pin to crosshair: programmable Joystick: proportionnal speed Chip hold on chuck by vacuum Two LCD display, used for wafer handling and for Test Monitoring. Video Target generator for alignment. Lights: Direct and pen LED lights. Facilities: Power: 100-240vac | ||||
其他半导体检测仪 DBT1000 / DBT1200 的工作原理介绍
其他半导体检测仪 DBT1000 / DBT1200 的使用方法?
DBT1000 / DBT1200 多少钱一台?
其他半导体检测仪 DBT1000 / DBT1200 可以检测什么？
其他半导体检测仪 DBT1000 / DBT1200 使用的注意事项？
DBT1000 / DBT1200 的说明书有吗？
其他半导体检测仪 DBT1000 / DBT1200 的操作规程有吗？
其他半导体检测仪 DBT1000 / DBT1200 报价含票含运吗？
DBT1000 / DBT1200 有现货吗？
