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真空回流焊:
Process environment | nitrogen, inert gas, formic acid, forming gas |
Maximum temperature | 450°C |
Heating area | 420 x 420 mm |
Heating plate | removable: graphite, aluminum, etc. |
Clearance above heating plate | 60 mm |
Heat up / cool down ramp | 250°C/min |
Control deviation | +/- 0.5°C |
Heating elements | 16x infrared heating lamps in two crossed rows |
Heating control | individual/adjustable on every heating lamp |
Cooling of heating plate | nitrogen flow |
Temperature measurement | up to 4x thermocouples K-Type freely positional |
Pressure measurement | full range over two gauges |
Maximum vacuum | 1x10-2 mbar (5x10-6 mbar with turbo pump) |
Formic acid bubbler | 40 ml container in front panel with auto refill |
Cooling of chamber body | water/ethylene glycol mixture |
Lid viewing port | 80 mm with shutter |
Display | 7" LCD with touch screen |
PC Software | process logging, recipe transfer, etc. |
User interface | remote control over relay I/Os |
Dimensions | see layout |
Weight | 280 kg |
Power supply | 3 phase, country specific |
著名客户:
应用:
在真空和惰性气体中加热、散热器上的功率半导体、倒装芯片回流焊、凸点熔化、高强度LED连接、密封封装密封、光伏电池组件、模具连接、印刷铜膜烧结、混合电路组件、扁平封装封装、微机电系统和光电器件封装,汽车传感器、高能电池等。
用户单位 | 采购时间 |
---|---|
深圳大学 | 2013-01-21 |
产品货期: 7天
整机质保期: 1年
培训服务: 安装调试现场免费培训
安装调试时间: 到货后7天内
电话支持响应时间: 2小时内
是否提供维保合同: 是
维修响应时间: 1天内
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