德国SUSS光刻机MJB4

SUSS MicroTec 掩模对准器以其成熟的曝光光学系统成为高品质和高对准精度的代名词。产品线从科研和开发设备，到全自动大规模生产系统。SüSS MicroTec 的掩模对准器系统主要用于 MEMS、先进封装、三维封装、化合物半导体、功率器件、太阳能、纳米技术和晶圆片级光学系统等领域的光刻应用。

SUSS MicroTec 的掩模对准和键合对准平台不仅能将掩模对准晶圆，还能让两个晶圆可靠地相互对准。设备可处理 300 mm 以下各种材料、任意厚度的衬底和晶圆。借助大量附加功能，掩模对准器不仅能满足多样化的工艺要求，还具有灵活的配置选项。

张先生 

MJB4 紫外曝光机/光刻机

Perfect Low-Cost Solution: 

•   High Accuracy 

•   Good Optical performance

•   latest processes (e.g. UV-NIL) 

Addressed Markets: 

•   MEMS 

•   Telecommunications

•   Compound Semiconductors

•   Nano Imprint Lithography 

Manual Tool: Easy To Operate 

Technical Data 

•   Wafer size: 1′′ up to 100 mm / 4′′ (round)

•   Min. pieces: 5 x 5 mm

•   Wafer thickness: up to 4 mm

•   Mask size: standard 2′′ x 2′′ up to 5′′ x 5′′ (SEMI) 

•   Mask thickness: up to 4.8 mm / 190 mil 

Exposure Modes 

•   Contact: soft, hard, vacuum, soft vacuum 

•   Proximity up to 50μm gap 

Optics 

•   UV250, UV300, UV400 and broadband optics

•   Intensity Uniformity ± 3% on 100mm

•   Constant power or constant intensity

•   Lamp sizes: 200W, 350W, 500W (for UV250)

•   Resolution down to 0,5 μm L/S (vacuum contact, UV250) 

Alignment

•   TSA alignment accuracy: 0.5μm (with SUSS recommended wafer targets) 

•   Transmitted IR Alignment accuracy: < 5μm (<2μm under special process conditions)

•   Alignment gap:10–50μm 

Single or splitfield microscope with/w/o CCD camera