美国PE公司1980年就开始致力于电子行业使用的等离子设备研发及相关服务, 至今已成为全美最著名的等离子系统解决方案专业供应商, 其旗下PE系列, BT大尺寸系列，大气压系列, PCB专用系列, Roll-to-Roll系列的发展历史已经超过了30年, 广泛应用于全球各大小型生产及研发实验室, 知名客户如美国宇航局NASA, 波音Boeing, 霍尼韦尔Honeywell, 摩托罗拉Moto, 德国拜耳Bayer, 军用飞机领军企业洛克希德马丁Lockheed-Martin, 及全美各大名校及科研院所如哈佛大学, 麻省理工, 莱斯大学, 橡树岭国家实验室等等。

美国PE公司拥有等离子技术领域里最顶尖的技术, 凭借着多年研发和突破性创新, 先已拥有了多项技术专利, 如专利的温控技术和专利的静电屏蔽技术, 使其等离子设备能提供无与伦比的处理效率, 均匀性和可靠性, 其刻蚀清洗效率是市面上其他等离子设备的三倍以上。 

MKII High Volume PCB Etching Systems --- PCB专用高容量等离子刻蚀系统

专利技术1---专利控温技术：

   在等离子处理过程中，温度也是确保均匀性，有效性的一个重要性能。美国PlasmaEtch等离子设备具备可调节电极温度的专利技术。通过电脑程序自动调节控制可保证整个等离子处理过程中温度的稳定性。这种技术是成熟可靠的，无需预热或预启动等离子设备就可以间歇或不断重复等离子处理过程。

专利技术2---专利静电屏蔽技术：

    研究表明，使用特种铝合金为腔体材料可以达到微调每个等离子直到最佳处理均匀性。等离子处理过程控制不当会导致对样品的损坏，均匀性欠佳导致样品区域性损伤和形变，因此美国PlasmaEtch设计了独有的静电屏蔽技术使得等离子高效均匀的在电极表面穿流而过，这一技术大大保障了最佳均匀的处理效果，避免了损伤和形变。

MK-II Plasma Etching System

Standard Features

Electrode Configuration

Default 24"Wx18"D (Several Optional Configurations) 6, 8, 12, 16 and 24-Shelf Systems Available

Generator

1250W to 5000W - 13.56MHz Continuously Variable Power Supply with Automatic Matching Network

Gas Control

Two 0-2000cc Mass Flow Controllers with Low Gas Source Alarm

Control System

Color PLC-Based Touch Screen Control Interface; Stores Multiple Three-Step Recipes

Vacuum Gauge

1-2000 mT

Vacuum Pump

29CFM - 56CFM 2-Stage Direct Drive Oil Pump (Oxygen Service – Krytox Charged)
    - with -
   Two Point Vacuum Pump Purge System
    3 Micron Oil Filtration System
   Oil Mist Eliminator
   - or -
   56CFM Dry Pump 
   355CFM or 845CFM Blower Booster

Chamber Material

6061-T6 Aluminum

Unit Dimensions

66”x79”x26”

Additional Features

Temperature Control System

Made in the U.S.A.
 

Optional Features

Most systems can be customized with a wide range of options including:

Custom Sized Vacuum Chamber, Number/Size of Electrodes

To ensure your system is able to specifically meet your throughput requirements

Reactive Ion Etching Electrodes

Enables reactive ion etching

KHz/MHz Power Supplies with Automatic Matching Network

Higher watt or different frequency power supplies

PC-based Control System

For fully automatic system control, multi-step process sequencing, multiple recipe storage, data logging/trending, events/alarms, etc.

Electrostatic Shielding

Greatly increases process uniformity across each shelf by eliminating excess etching at the outer bounds of the processed material

Temperature Control System

To maintain specific temperatures in the processing chamber for enhanced uniformity between shelves and application-specific needs

Dry and Oil-Driven Vacuum Pumps and Blower Boosters

A variety of vacuum pump options for more control over the process chamber pressure

Chiller System for Dry Vacuum Pump

Necessary for the operation of a dry vacuum pump

Chamber and Vacuum Pump Purge Systems / Air Dryer / Purge Gas Generator

To ensure thorough removal of contaminants from the etching system, providing uniformity and increasing longevity

Vacuum Pump Oil Mist Eliminator

Captures oil from vacuum pump exhaust

Vacuum Pump Oil Filtration

Filters the vacuum pump oil down to a 3 micron level which increases the longevity of the oil and the vacuum pump

Automatic Vacuum Control

Provides automation of the process chamber pressure

Additional Digital Mass Flow Controllers

Provides digital automation and monitoring of process gases

Software Configurable Gas Steering Matrix

Designed to allow for up to 5 process gas inputs; up to 3 are selectable at any time by software driven controls

Low Gas-Source Alarm

Notification for when your process gas container needs replenished

Light Tower

For easy visualization of the steps of the plasma processing sequence

Fume Scrubber

To eliminate hazardous fumes/contaminants from the chamber/vacuum pump exhaust of the etching system