高速锡球剪切力及拉力测试对比机械跌落实验High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading Speed

We investigated the effect of burstmode with nanosecond (ns) time delay between subpulses on sodalime glass volume machining. We observed in tight focusing configuration that the use of burstmode with ns time delay between subpulses does not increase the absorption efficiency and does not bring a significant effect on the heat affected zone diameter with respect to single pulse mode. On the contrary in loose focusing configuration the use of burst mode allows increasing the aspect ratio of the heat affected zone without extra energy absorption. This effect is highly interesting for filamentation glass cutting applications.

X光检测系统是PCB和半导体器件质量控制、成品率提高和失效分析的关键工具。在许多情况下，这些强大的工具提供了检查电子元件的唯一无损技术。在过去的几年中，X光检查能力(2D和3D)有了显著的改进。在本文中，我们报道了一种新的发展，允许通过二维x射线检查获得材料和厚度信息。

X光无损检测及超声波无损检测应用手册 X光和超声波成像是两个非常有益的工具，用于无损检测电子组件产品的质量。这两种技术都提供了关于组件完整性的不同方面的信息。

The development of new display technologies, such as organic LEDs and flexible displays, put stringent requirements in terms of manufacturing processes. We report on new results aiming at improving processing quality and yield.