2016/04/22 12:58
阅读:383
分享:免费下载
方案摘要:
产品配置单:
DAGE4000HS高速推拉力测试机
型号: DAGE 4000HS
产地: 英国
品牌: 诺信达格
面议
参考报价
联系电话
DAGE4000多功能推拉力测试机
型号: DAGE 4000
产地: 英国
品牌: 诺信达格
¥1 - 9999
参考报价
联系电话
方案详情:
Conclusions
This study investigated the brittle failure mechanism of high-speed ball shear/pull testing. Two kinds of solder alloys (SAC405 and SnPb) with ENIG package substrate pad finish were studied. The brittle fracture surfaces were inspected by SEM/EDX after ball shear/pull testing. The major findings follow:
1) High-speed solder ball shear and pull tests produced high brittle fracture failure rates, regardless of solder composition.
2) Solder ball pull testing generated a higher percentage of brittle failures than solder ball shear testing, at all test speeds, and for both SAC405 and eutectic SnPb samples.
3) In drop testing, SAC405 showed a greater susceptibility to brittle fracture than Sn-Pb solder alloy, coincident with the results of the high-speed solder ball shear and pull tests.
4) SEM imaging and EDX mapping of the fracture interfaces indicates that the brittle failures for the drop, shear and pull testing all occurred at the Ni/IMC interface and resulted in nearly identical fracture surfaces.
5) High-speed pull tests revealed the brittle interface with a greater sensitivity than in the ball shear test, especially for SnPb solders, due to the absence of secondary solder ball interactions with the solder mask and the already fractured surface.
6) SEM/EDX analysis of the fracture surfaces indicated that solder residue on the package pad is more prevalent for SnPb solder compared to SnAgCu solder, and for highspeed shear testing compared to pull testing.
下载本篇解决方案:
更多
飞秒激光器的突发模式对透明材料处理的影响Effects of burst mode on transparent materials processing
We investigated the effect of burstmode with nanosecond (ns) time delay between subpulses on sodalime glass volume machining. We observed in tight focusing configuration that the use of burstmode with ns time delay between subpulses does not increase the absorption efficiency and does not bring a significant effect on the heat affected zone diameter with respect to single pulse mode. On the contrary in loose focusing configuration the use of burst mode allows increasing the aspect ratio of the heat affected zone without extra energy absorption. This effect is highly interesting for filamentation glass cutting applications.
建材/家具
2016/09/02
用二维X光检查材料和厚度识别
X光检测系统是PCB和半导体器件质量控制、成品率提高和失效分析的关键工具。在许多情况下,这些强大的工具提供了检查电子元件的唯一无损技术。在过去的几年中,X光检查能力(2D和3D)有了显著的改进。在本文中,我们报道了一种新的发展,允许通过二维x射线检查获得材料和厚度信息。
电子/电气
2021/05/08
X光无损检测及超声波无损检测应用手册
X光无损检测及超声波无损检测应用手册 X光和超声波成像是两个非常有益的工具,用于无损检测电子组件产品的质量。这两种技术都提供了关于组件完整性的不同方面的信息。
半导体
2021/05/08
用于移动显示器制造的飞秒激光加工Femtosecond laser processing for mobile display manufacturing
The development of new display technologies, such as organic LEDs and flexible displays, put stringent requirements in terms of manufacturing processes. We report on new results aiming at improving processing quality and yield.
电子/电气
2016/09/09