半导体行业解决方案之热分析应用

Discovery TGA系列热重分析仪

差示扫描量热分析(DSC)是测量固化行为的理想技术，无论固化过程涉及加热还是光照。DSC可测量样品升温所需的热量，是表征转变潜热、材料转变温度和热容等特性的有效方法。

Discovery DSC系列差示扫描量热仪

Discovery TMA系列热机械分析仪

动态热机械分析(DMA)可分析材料的力学响应如何随外力和温度的变化而变化。测量材料的机械性能，而机械性能是时间、温度和频率的函数。除了量化材料的黏弹性，DMA还可量化成品组件和产品特性，反映加工对最终用途产品性能的重要贡献。

Discovery DMA 850动态热机械分析仪

Discovery Flash系列闪射分析仪

【1】Ren, X., Zhang, Y., Liu, Y., Yang, C., Dai, S., Wang, X., & Liu, J. (2022). Preparation and Properties of Intrinsically Black Polyimide Films with CIE Lab Color Parameters Close to Zero and High Thermal Stability for Potential Applications in Flexible Printed Circuit Boards. Polymers, 14, 3881. https://doi.org/10.3390/polym14183881

【2】Lee, T. Y., Su, M., Yong, K., Ko, H., Ho, Y., & Sehoon, K. (2020). Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica  filled non  conductive adhesive for fine-pitch thermocompression bonding. Journal of Materials Science: Materials in Electronics, 31(2), 1227–1235.  https://doi.org/10.1007/s10854-019-02634-w

【3】Sharar, D. J., Wilson, A., & Tsang, H. (n.d.). Intra- and inter-device passive thermal management using solid-solid Nickel Titanium phase change materials. 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 1–7.https://doi.org/10.1109/iTherm54085.2022.9899587