tSeries 300mm Sorters

• 300mm FOUP/FOSB carrier compatible·2 / 3 port inline or 4 / 6 port back to back

• Industry standard SANKYO trackless dual yaw OEM robotics

• Industry standard Sinfonia/TDK 300mm ports

• optional BOLTS compliant open cassette adapters to allow 150mm and 200mm open cassette carriers

• optional auto detect adapters for seamless 200mm OC to 300mm FOUP detection

• Integrated RFID and E84 OHT delivery options

• Sub class 1 particle performance

• Smallest 300mm two port footprint available

• Automation capable with SECSII/GEM/HSMS/GEM300

• GUI based tools for easy recipe development

• UPS power backup +vacuum reservoir.

sSeries 200mm SMIF Sorters

• 200mm 2 port SMIF carrier compatible·

• Industry standard MOOG OEM robotics

• Industry standard SMIF 200mm ports

• Sub class 1 particle performance

• Automation capable with SECSII/GEM/HSMS

• GUI based RBuilder for easy recipe development

• UPS power backup + vacuum reservoir

• available with select Sorter+ options

nSeries OC Sorters

• 4 station open carrier wafer sorter

• 50mm to 200mm wafer sizes.

• Dual paddle buffering for same carrier sorting

• 350wph OCR / 800wph transfer

• smallest 4 station single level footprint available in industry

• 4 station for better queuing and larger on tool splits

• Many concurrent wafer size options available

• All sorter+ options can be added on this tool size

• Optional AUTOTEACH

Sorter+

inspection and metrology options for wafer sorters

• hologenix slip finder

• addition of slipfinder hardware and software

• wafer slip is detected and measured using propriety Hologenix lighting and software

• typical usage in wafer manufacturing, SOI and EPI

• recipes can scan outer wafer edge, center of wafer, both or entire wafer

• wafer thickness measurements

• AVG thickness / TTV / bow / warp

• single center point or radial profiling

• confocal laser or white light interferometer depending on application

• function can be added to any typical sorting recipe

• typical recipes bin wafer based on thickness

• option for any system using OCR

• measures scribe location against a qualified location

• automated characterization

• automated inspection

• function can be added to any typical sorting recipe

• includes GEM/SECS reporting for X/Y and linear offests

• limits monitoring and alarms

• Top and Bottom Bevel Inspection Option

• bolt on application for NADA or PST sorters

• inspection option which scans the wafer bevel for cracks and chips

• standard ascii and SECS/GEM reporting with defect size and location

• optional image capture and industry standard XY Report Formating

• captures defects down to 0.5mm

• function can be added to any typical sort recipe

• lastest generation seeing defects down to 60um

• flip option for wafer flip applications

• 180 degree for standard wafer flip

• 90 degree quartz carrier vertical loading

• hologenix dimple detection

• addition of dimple hardware and software

• dimples are detected and measured using propriety Hologenix lighting and software

• typical usage in Si wafer manufacturing and MEMS markets

• whole wafer image processing or magnified version are available

• optional stocker and AGV integrated E84 delivery

• front side bright light inspection

• bolt on application for NADA or PST sorters

• wafer topside ONLY visual inspection

• joystick control or programmable recipe control with pass/fail button

• function can be added to any typical sorting recipe