Cast N' Vac 1000 真空镶嵌机

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综合钢铁/金属医疗/卫生电子/电气能源/新能源生物产业

铝-硅 Al-Si中相图检测方案(磨抛机)
本篇Tech-Note主要研究Al-Si相图，这样的研究具有很重要的实际意义。二元相图是研究复杂合金的基础。在Al合金中的Si和Fe被认为是杂质元素存在，但是在铸造和锻造Al合金中Si又是一种添加元素。各种铸造Al合金中Si的含量从5~22%（重量比）不等。
钢铁/金属 2009-09-18
工具钢、铁碳合金中马氏体和残余奥氏体检测方案(切割机)
马氏体的研究对于大多数钢铁材料等的热处理过程有着非常重要的意义！本文主要讨论马氏体转变时，残余奥氏体存在的条件、如何判别和检测残余奥氏体，以及残余奥氏体存在的危害。
钢铁/金属 2009-09-18
PCB中金相制备检测方案(切割机)
Microsectioning has become a standard requirement of printed wiring board (PWB) quality assurance due to the potential for hidden, subsurface defects, and for process control. In recent years, increasing numbers of PWB customers have begun to require certified vendors to perform statistical sampling of their product. Cost reduction initiatives are the driving forces which have shifted this responsibility to the vendor. Many wiring board manufacturers, however, are unprepared for this shift. Their microsectioning capabilities remain manual in nature, and they are poorly equipped to handle the volume of coupon cross-sectioning necessary to meet their customer’s requirements. Often, all that is needed is a small investment in microsectioning automation, but the perceived costs keep many PWB production houses from taking this critical step. In addition, many are fearful that automation will result in loss of jobs. While it is true that automation will free significant amounts of time for workers to focus on other efforts, it does not eliminate the need for operators altogether. This paper offers a look at manual and automated microsectioning of PWB’s, with the purpose of illustrating the time and cost benefits of automation.
电子/电气 2008-01-15
电子元器件中失效分析检测方案(镶嵌机)
Microelectronics, Part I: Cutting, Mounting Written by: Scott Holt,Applications Engineer,Buehler Editor:George Vander VoortDirector, Research and Technology, Buehler Introduction For most microelectronic devices and packages, direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive inspection are employed. In order to produce a cross section, many of the techniques used in the metals industry have been borrowed; to a large degree, with success. However, the philosophy and logic for choosing a particular method of cutting, mounting, and abrasive preparation has often been lost in the process. This is of extreme significance because the needs of the microelectronics industry vary greatly from those of the metals industry. Issues such as feature size, specific area cross sectioning, and the ability to prepare a variety of materials with different mechanical properties within a single plane of polish require an understanding of basic abrasive processes so that appropriate sectioning methods might be developed. This issue of TECH-NOTES is the first half of a two part effort to summarize some of the basic concepts involved in proper preparation of microelectronic materials. We will discuss some simple guidelines which the microelectronic materials analyst might draw upon in the development of better preparation techniques. In particular, this issue will cover the variables involved in cutting and mounting of microelectronic materials, and summarize some of the technique and consumable choices that must be considered in order to achieve quality results. The next microelectronics issue of TECH-NOTES will continue with the abrasive processes of grinding and polishing these materials.
电子/电气 2007-01-19

铝、铝合金、钛、钛合金、耐火材料中金相组织结构检测方案(磨抛机)
越软、延展性越好的材料，在机械抛光作用下，划痕越难去除，越容易被掩盖。在机械+化学作用下抛光理论的提出，才使得这些疑难逐渐被破解。本文主要介绍一些常见的使用机械+化学作用抛光的应用。
钢铁/金属 2020-09-11
Nb铌金属中金相制备检测方案(切割机)
铌元素符号：Nb，原子序数41，是VB族金属。铌是一种银灰色、质地较软且具有延展性的稀有高熔点金属。由于铌具有良好的超导性、熔点高、耐腐蚀、耐磨等特点，被广泛应用到钢铁、超导材料、航空航天、原子能等领域。
钢铁/金属 2020-07-20
工具钢中金相分析检测方案(镶嵌机)
工具钢是一种非常重要的材料，它的化学成分组成从简单的塑性成型的模具钢和淬火水冷的碳钢到高合金的高速钢。在工具钢和模具钢的失效分析中，有时会观察到各种各样我们不希望出现的显微组织。
钢铁/金属 2010-01-19
铝-硅 Al-Si中相图检测方案(磨抛机)
本篇Tech-Note主要研究Al-Si相图，这样的研究具有很重要的实际意义。二元相图是研究复杂合金的基础。在Al合金中的Si和Fe被认为是杂质元素存在，但是在铸造和锻造Al合金中Si又是一种添加元素。各种铸造Al合金中Si的含量从5~22%（重量比）不等。
钢铁/金属 2009-09-18

血管支架中金相制备检测方案(切割机)
冠状动脉支架是一种金属支架，它具有良好的塑性和几何稳定性，可在闭合状态下经心导管送至病变部位，再用气囊扩张等方法使之展开，起到支撑血管壁的作用。冠状动脉支架可以将已经狭窄或闭塞的血管撑开，恢复冠状动脉的血流，从而改善心肌供血。正确的制备技术将增强对临床支架的细胞反应的理解，特别是在组织支架界面。此外，它还可以对扩展特性进行周密的评估。这样的观察甚至可能促使支架设计的改进及发展。
医疗/卫生 2021-11-02
医用材料和设备中金相组织结构检测方案(切割机)
这本手册概述了制备样品进行分析时医学界所面临的一些挑战。采用Buehler的专业技术，尤其是设备、耗材以及在医疗电子失效分析中的服务，这些挑战会以各种方式得到解决。我们的培训计划提供了关于设备和耗材的深入知识、支持和示范。
医疗/卫生 2011-12-16
血管支架中金相制备检测方案(切割机)
冠状支架是一些金属支架，可以在已经闭合或是看起来很可能要闭合的动脉中与一个气囊导管一道扩展。冠状支架通过支撑开启动脉恢复足够的血液流动到心肌。冠状支架的发明人是Charles Dotter，他在1969年研制出他的首个支架。Charles Dotter 继续改进和发展他的设计并在1983年与Andrew Craig一道发明了一种可以扩展的支架，这是用一种镍钛合金制造的，目前这种材料经常用来制作支架。随着支架的使用越来越成为平常的事情，对于人体和支架的交互作用有较好的理解始终是一个重要的临床议题。对于不同的支架设计、材料、表面涂层、以及附属的药物处理的研究要求对于装有支架的血管进行详尽的组织学和免疫组织化学分析，特别是在支架原位的细胞组织与金属的界面处。正确的制备技术将会增强对细胞组织对临床安装支架（特别是在细胞组织与支架的界面处）的反应。此外，它还可以对扩展特性进行周密的评估。这种观察甚至能导致研制出经过改进的支架设计。
医疗/卫生 2006-10-20
带植入物的骨骼中金相制备检测方案(切割机)
在过去十年，骨骼和组织损伤的修复技术，已经有了很大的进步。像髋关节植入物和展伸等器件已经广泛用于修理和矫正等问题，而在过去，这些都是难于修理的。植入物在体内的生物兼容性是一个主要的关注问题也是需要进行显微组织检查的主要原因。一个成功的植入要求骨骼或组织能接受植入物并且不排斥植入手术。与此同时，外科植入物还暴露在身体的生物化学环境并可能造成降解。为了评估这种兼容性，为进行显微分析而进行的任何制备技术都应当避免使骨骼或组织受到损伤，与此同时，还应当保持植入物的原始真实性。骨骼具有海绵质并可以再生，因此能够随着时间改变其体积。而植入物则较硬，体积不会改变，在人体中会降解并造成失效。硬的植入物和软的骨骼或组织在硬度上的差异，对于试样制备是一个挑战。对于骨骼和组织的研究有两种方法。薄截面试样可用于X射线照相术以及在透射光下进行显微观察。大块试样则在反射光下进行显微观察。更常使用的是薄截面试样，它比大块试样能提供多得多的信息，下面将进行详尽讨论。
医疗/卫生 2006-10-20

PCB中金相制备检测方案(切割机)
Microsectioning has become a standard requirement of printed wiring board (PWB) quality assurance due to the potential for hidden, subsurface defects, and for process control. In recent years, increasing numbers of PWB customers have begun to require certified vendors to perform statistical sampling of their product. Cost reduction initiatives are the driving forces which have shifted this responsibility to the vendor. Many wiring board manufacturers, however, are unprepared for this shift. Their microsectioning capabilities remain manual in nature, and they are poorly equipped to handle the volume of coupon cross-sectioning necessary to meet their customer’s requirements. Often, all that is needed is a small investment in microsectioning automation, but the perceived costs keep many PWB production houses from taking this critical step. In addition, many are fearful that automation will result in loss of jobs. While it is true that automation will free significant amounts of time for workers to focus on other efforts, it does not eliminate the need for operators altogether. This paper offers a look at manual and automated microsectioning of PWB’s, with the purpose of illustrating the time and cost benefits of automation.
电子/电气 2008-01-15
电子元器件中失效分析检测方案(镶嵌机)
Microelectronics, Part I: Cutting, Mounting Written by: Scott Holt,Applications Engineer,Buehler Editor:George Vander VoortDirector, Research and Technology, Buehler Introduction For most microelectronic devices and packages, direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive inspection are employed. In order to produce a cross section, many of the techniques used in the metals industry have been borrowed; to a large degree, with success. However, the philosophy and logic for choosing a particular method of cutting, mounting, and abrasive preparation has often been lost in the process. This is of extreme significance because the needs of the microelectronics industry vary greatly from those of the metals industry. Issues such as feature size, specific area cross sectioning, and the ability to prepare a variety of materials with different mechanical properties within a single plane of polish require an understanding of basic abrasive processes so that appropriate sectioning methods might be developed. This issue of TECH-NOTES is the first half of a two part effort to summarize some of the basic concepts involved in proper preparation of microelectronic materials. We will discuss some simple guidelines which the microelectronic materials analyst might draw upon in the development of better preparation techniques. In particular, this issue will cover the variables involved in cutting and mounting of microelectronic materials, and summarize some of the technique and consumable choices that must be considered in order to achieve quality results. The next microelectronics issue of TECH-NOTES will continue with the abrasive processes of grinding and polishing these materials.
电子/电气 2007-01-19
集成电路(IC)中集成电路(IC)金相制备检测方案(磨抛机)
电子学是工程学的一个重要分支, 它是一门关于为了有用的目的而对电子进行控制的学科。运用物理学的知识得知, 电子的流动可以在真空、气体、或液体中进行，也可以在固体中受限制地流动（半导体）、接近不受限制地流动（导体）、或完全不受限制地流动（超导体）。当今, 电子产品正变得越来越复杂，工程技术人员总是力图将许多部件放在一个小小的“黑匣子”中。制造商总是想把大部分资金用在改善其生产设施，而只愿意留下很少一部分资金用于质量控制。最坏的情况是，大多数公司宁愿把他们的质量控制资金用于基本设备投资，例如购买新型扫描电子显微镜、透射电子显微镜，或是厄歇谱仪，只剩下很少一部分钱用来购买试样制备设备和消耗器材。一个众所周知的现象就是人们对试样制备的重要性一直不够重视。另一方面, 毫无疑问，最终产品的质量和可靠性取决于每个部件的性能。然而，这也总是电子工业的一个令人头痛的问题。对电子产品的截面进行金相检验是一种众所周知并通常广为接受的检验方法。然而，大多数电子产品的金相技术人员可能面临的一个问题就是他们需要进行磨光和抛光的材料比预期的复杂和困难。他们也许从来没有学习过如何去处理多层基体材料，而他们在大学学习时只学过如何恰当地制备均匀的材料，例如钢、铜合金或铝合金。此外，他们还须面对设备很差的金相实验室，消耗器材的品种也很有限，并且使用所谓的“传统或常规方法”来制备先进的电子产品试样。一般情况下，常规试样制备方法是从240#碳化硅砂纸开始，先进行磨成平面工序，接着使用600#、1200#砂纸，然后用0.3 ?m 氧化铝进行粗抛光，以及0.05 ?m 氧化铝在长绒毛织物上进行最终抛光，这样可获得光亮的表面。制备方法还可能因地而异，甚至还取决于实验室有哪些现成的消耗器材。当今，这种制备方法已经不适于用来制备先进材料。此外，他们也没有想到他们的试样是否好到足以和先进的显微镜或扫描电子显微镜相匹配。在本文中，我们试图给出各种集成电路（IC）封装、引线连接，以及其它部件的试样制备方法。
电子/电气 2006-10-20

新能源动力电池中金相制备分析检测方案(切割机)
从三元粉末铝箔到正极材料、从石墨铜箔到负极材料、成品电池及电池壳体的激光焊接等等的质量管控都离不开金相设备的助力，下面我们介绍下电池各组件的金相制备方案。
能源/新能源 2022-05-12

耳石（脊椎动物内耳）中样品制备检测方案(切割机)
耳石（脊椎动物内耳）的显微组织分析对于研究鱼的生长模式和年龄是一个重要的工具。这一信息可进一步用于总的鱼群、物种动态特性、以及了解环境变化的影响等更大范围的研究。鱼的年龄通常是通过检查和计数鳞片上的生长环或是在耳石（内耳的小骨）上看到的环状组织来确定的。这些环对应于环境的季节变化并可以与树干的年轮相比较。如果这些环生长迅速，它们的间隔就比较宽；当环与环之间的间隔比较窄时，就表明生长比较缓慢。耳石共有三对，最常分别称为耳沙（内耳囊状物部分的一种石状物）、扁平石（多数鱼的两个耳石中较大的一个）、和星状耳石。它们的所在位置、功能、尺寸、形状、以及超微结构方面均不相同。这些差异会影响到制备方案的确定，例如抛光面以及所必需的制备量。尺寸具有特殊的重要性，因为较大耳石具一般有较大的三维深度和不规则性，从而限制了显微组织的外观观察。另一方面，对于较小的耳石，有可能不经切割或抛光就可以观察其显微组织。大多数情况下，需将耳石清洁而准确地切割成非常薄的截面。这样就可以看到环状组织。对于厚度大于100μm的耳石，将试样抛光可能会更好些。这样做在观察环状组织时将使分辨率得到改善。为了能继续增进对鱼群动态特性的了解，很好地确定耳石的分离、制备、和分析技术并适当侧重质量控制十分重要。许多情况下，研究者已经拟订出针对某一物种的特定方法。这里所介绍的方法还是属于相当一般性的。
生物产业 2006-10-20

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