SET ACCμRA 100 芯片与晶圆键合机

ACCμRA 100

法国SET的键合压力控制在不同的范围内采用了不同的高精度压力传感器，确保了在不同的压力范围内，都能够得到非常好的压力控制精度。

Applications

• Laser diode, laser bar • VCSEL, photo diode

• LED

• Prisms, lenses, mirrors • Micro assembly 

• Flip-chip bonding, die bonding

• Chip-to-chip, chip-to-substrate bonding

Specifications

• Accuracy* ±0.5 μm

•Post-bond accuracy: +/- 1 μm 

•Range of force :20 g to 100kg

•Temperature up to 450°C 

Independent heating for chip and substrate 

•High resolution vertical movement 

 74 mm, resolution 0.05μm  Driven by brushless motor