The LM 500 is a bench floor single-plate lapping machine, utilized to flatten the chip face which will be glued to a slide and to perform the final thin section sample thickness reduction. The powerful apparatus can simultaneously process up to 6 chips or 24 thin sections, with an exceptionally high degree of surface finish. By removing subsurface damage caused by sawing and grinding, the desired specimen thickness and evenness are achieved. The device is mainly composed of a rotating grooved cast iron plate, a chip lapping jig, a precision thin section lapping jig, a lapping thickness tuning tool, an unevenness correction rim and an abrasive fluid (e.g. silicon carbide) dispensing and recycling system. Via a control panel, the operator can manually control the apparatus or run it in the automatic mode. 

FEATURES:

Specimen size: 30x45mm, 1 inch x 1.5 inch (small size)
60 x 45mm or 1 inch x 3 inch (large size)
Jig capacity: according to jig model
Variable speed: 20 to 75 RPM 
Plate diameter: 500 mm
Timer: 0-10 hours
Dimensions: 700 x 700 x 1,400 mm
Weight: 250 kg
Power supply: 220 VAC - 50/60 Hz 

BENEFITS:

* Vibration-free at low speeds 
* Laps chips and thin sections
* Easy access for rapid and effortless cleaning
* High simultaneous processing rate
* Automated operations