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Board Contact (Type I)
This contact configuration has a conveniently removable
reusable sample carrier onto which the chip is mounted.
Direct Chip Contact (Type II)
This contact configuration has a unique single chip that
is directly inserted in the holder in a proprietary connector with up to 9
electrical contacts.
Spring Contact (Type III)
The spring contact configuration is a variation of the
Type I connector that has fixed location spring contacts between the chip and
the carrier.
Application Examples
?Correlating electrical properties of nanoscale material with microstructure ?Relating material defect populations to the electrical response Electromigration studies ?Operating microelectomechanical systems (MEMS)-based mechanical testing devices ?In-situ testing of solid-state energy devices
Options
?The 1600 Series Holder can be customized from a range of options. ?Custom designed sample carriers to fit any TEM sample geometry. ?Standard Bundled Shielded Wiring Option ?Low noise, individually shielded cabling option for pA range current measurements. ?Keithley 2400 SMU
Accessories
?Accessories available to maximize the versatility and ease of use of your Electrical Biasing Holder. ?Specialized Sample Substrate Chips ?Vacuum Tip Cover ?Custom Chip Carriers ?Keithley 2400 SMU
Nanoelectronics
Allowing researchers to perform in-situ TEM electrical measurements is a
powerful tool for research into next generation of nano-scale electrical devices.
Electrical signals can be applied or measured on individual nano-structures and devices, revealing
relations between electrical behavior and microstructure.
Top: TEM images taken in-situ during the
voltage scan in panel, at times I, II, III, and IV. Note the correlation of
resistance with void size.
Bottom: Voltage scan on a single nanowires device (inset). The blue square in
the inset shows the location of the TEM observation in panel B.
From Void Formation Induced
Electrical Switching in Phase-Change Nanowires, Nano Letters 8, 4562, 2008. Image
courtesy of Profs. Yi Cui, Stanford University and Andrew Minor, UC Berkeley.
Specification:
Items | 1600 Series |
Tilt Range | ±45° depending on microscope and pole piece |
Number of Electrical Contacts | 6, 8, or 9 * |
Contact Type | Flexible wirebond contacts or fixed spring contact |
Chip Carrier | Mobile Chip Carrier |
Carrier Compatibility | Standard TEM Sample Supports |
Carrier Size | Fits up to 3 x 6 mm samples |
Wiring | Standard or Low-noise shielded |
TEM Compatibility | FEI, JEOL, Hitachi, Zeiss |