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Mini MASTER Overview

Mini MASTER workstations are tailored for specific applications. Intended primarily for Research and Development laboratories, Mini MASTERs offer excellent payback while keeping high performance.

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• Description

  
  

• Specifications

  
  

• Options

  
  

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• Mini MASTER's are high payback laser micro machining workstations tailored for specific applications in Research and Development laboratories or small batch production.

  Being smaller brothers of MASTER workstations, Mini MASTERs perform marking, cutting drilling, surface structuring and fit into reduced foot print.

  Ultra short pulse lasers and SCA laser micro machining software complies to high requirements in solar cells applications, extra hard materials processing (like tungsten carbide), etc.

Description

Speed and spatial precision	Precision of laser micro machining is achieved by ultra-short laser pulses, state of the art Galvo Scanners and optics. In Mini MASTER workstations nano or pico second laser pulses cause minimal heat-affected zone and maximize spatial precision. High pulse repetition rate and adequate pulse energy ensure fast material removal during ablation or marking. Options of three different working wavelengths offer many machining possibilities for wide range of materials.
Accuracy of positioning	Maximum firing accuracy and spatial resolution are achieved due to advanced beam delivery scheme. Fast galvoscanner for high throughput.
Safety and robustness	Class 1 laser-safe and clean-room compatible enclosure ensures robustness and reliability.
Advanced control	Designed specifically for laser micro machining, SCA software provides automatic control of Mini MASTER workstation, easy design or import of patterns, flexible modification and simulation of micro machining process
Applications	Ablation	Manufacturing of high aspect Micromolds from conductive and non-conductive materials using multiple 2D process Production of high-aspect ratio micro- channels fo Microfluidics Structuring high density circuit boards for thin films electronics
	Cutting and drilling	Flexible production of Micromechanics components Cutting and drilling of saphire and other crystal materials High-aspect-ratio holes for injectors Filter production
	Marking	Surface & intravolume marking of transparent materials Flexible production of Identification & anti counterfeiting marks
	Surface Structuring	Clean and accurate modification of wettability characteristics of a wide range of engineering materials Selective surface structuring for Antireflection Lubrication modification of 2D and 3D objects

Specifications

Galvo scanner

Optics

Physical Characteristics

(* Dimensions can be adjusted during design of ordered workstation)

Options

Laser options

Customization options

• Tables for samples with motorized or manual Z and tilt axis adjustment

• Automatic harmonics switching

• Automatic focus adjustment

• Automatic scanner self - calibration

• Vacuum chucks for sample holding

• Dust and fume extraction system