大师系列

MASTER workstations - Precision and Versatility

MASTER series workstations offer cutting- edge laser micromachining capabilities for unlimited range of materials. MASTER workstations are used for scientific research and industrial process development. Applications range from silicon ablation for solar cells to metal drilling for diesel nozzles and patterning of extra hard materials.

Key features:

• Micron precision laser material processing

• High energy Pico or Femto second pulse lasers

• Wavelength range from infrared to ultraviolet

• Wide range of laser, mechanics and optics options

• Professional software for laser micromachining and system control

• Vibration-isolated granite platform in stand alone Class 1 laser safety body

• Description

  
  

• Specifications

  
  

• Options

  
  

• Drawings

  
  

• Send request

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• Description

• Speed and spatial precision	Precision of laser micro machining is achieved by ultra-short laser pulses, precision of positioning stages and state of the art optics. In MASTER series workstations pico second or femto second laser pulses cause minimal heat-affected zone and maximize spatial precision. High pulse repetition rate and adequate pulse energy ensure fast material removal during ablation or drilling. Options of three different working wavelengths and combination of several wavelengths into a single beam offer enormous machining possibilities in terms of materials and processes.
  Accuracy of positioning	Maximum firing accuracy and spatial resolution are achieved due to advanced beam delivery scheme. Ultimate  precision three-axis linear positioning stages for precise 3D ablation Fast galvoscanner for high throughput. Trepanning unit for advanced drilling.
  Vibration-free	Rigid vibration isolated granite platform in Class 1 laser-safe and clean-room compatible enclosure ensures robustness and reliability.
  Advanced control	Designed specifically for laser micro machining, SCA software provides automatic control of MASTER workstation, easy design or import of patterns, flexible modification and simulation of micro machining process
  Applications	Ablation
  	Cutting and drilling
  	Marking
  	Surface Structuring

• Clean and accurate modification of wettability characteristics of a wide range of engineering materials

• Selective surface structuring for Antireflection

• Lubrication modification of 2D and 3D objects

• Surface & intravolume marking of transparent materials

• Flexible production of Identification & anti counterfeiting marks

• Flexible production of Micromechanics components

• Cutting and drilling of saphire and other crystal materials

• High-aspect-ratio holes for injectors

• Filter production

• Manufacturing of high aspect Micromolds from conductive and non-conductive materials using multiple 2D process

• Production of high-aspect ratio micro-channels fo Microfluidics

• Structuring high density circuit boards for thin films electronics 

Specifications

• Positioning system

• XY axis
  Travel X,Y	200 mm
  Maximum travel speed	2000 mm/s
  Maximum linear acceleration	30 m/s2 (no load)
  Accuracy	± 1 μm or better
  Repeatability	0.10 μm or better
  Z axis
  Travel Z	100 mm
  Maximum travel speed	400 mm/s
  Maximum linear acceleration	30 m/s2 (no load)
  Accuracy	± 1 μm or better
  Repeatability	0.10 μm or better

• (*Wide range of choice for all parameters)

• Optics

• Spot size (optics and wavelength dependent)	down to 3 μm
  Output beam	single- or multi-wavelength

• Control

• System control	Industrial type control computer LCD display and keyboard SCA software running on MS Windows OS
  Laser and motion synchronization	Laser pulse synchronized output

• Physical Characteristics

• Dimensions (approx.), W×D×H	1300×1200×1700 mm
  Power requirements, maximum	4500 W

• (* Dimensions can be adjusted during design of ordered workstation)

Options

• Laser options

• Laser	Wavelength and power	Pulse energy	Pulse duration	Repetition rate	Beam quality
  Picosecond laser	16 W @ 1064 nm >8 W @ 532 nm >4 W @ 355 nm	>160 μJ @ 1064 nm	<10 ps	Single shot to 500 kHz	M2< 1.5
  Femtosecond laser	5 W @ 1028 nm	1mJ	< 200 fs	Single shot to 200 kHz	M2<1.2

• Customization options

• Digital vision system for process control

• Dual axis galvo-scanner for complex high speed beam process

• Optical setup for helical drilling with predefined taper

• Rotary and tilt axes for increased machining freedom for complicated structures

• Several wavelengths combined in one system (1064 nm, 532 nm and/or 355 nm)

• Holders  and vacuum chuck for objects

• In-built filter system for collection of airborne particles from material processing

• Harmonics generator for 2nd, 3rd and 4th harmonics (for femto-Master workstation)

Drawings