电子元器件的切割和镶嵌-失效分析
Microelectronics, Part I: Cutting, Mounting Written by:Scott Holt,Applications Engineer,BuehlerEditor:George Vander VoortDirector, Research and Technology,Buehler Introduction For most microelectronic devices and packages,direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructiveinspection are employed.In order to produce a cross section, many ofthe techniques used in the metals industryhave been borrowed to a large degree, withsuccess. However, the philosophy and logicfor choosing a particular method of cutting,mounting, and abrasive preparation has oftenbeen lost in the process. This is ofextreme significance because the needs ofthe microelectronics industry vary greatlyfrom those of the metals industry. Issues suchas feature size, specific area cross sectioning,and the ability to prepare a variety ofmaterials with different mechanical propertieswithin a single plane of polish requirean understanding of basic abrasive processesso that appropriate sectioningmethods might be developed.This issue of TECH-NOTES is the first half ofa two part effort to summarize some of thebasic concepts involved in proper preparationof microelectronic materials. We willdiscuss some simple guidelines which themicroelectronic materials analyst might drawupon in the development of better preparationtechniques. In particular, this issue willcover the variables involved in cutting andmounting of microelectronic materials, andsummarize some of the technique and consumablechoices that must be consideredin order to achieve quality results. The nextmicroelectronics issue of TECH-NOTES willcontinue with the abrasive processes ofgrinding and polishing these materials.