蓝宝石精密切割裂片机Sapphire Material Cutting Machine产品简介:采用红外皮秒激光器,保证完美光束质量,光斑细,切割精度高。IR picosecond laser is used to ensure perfect beam quality, fine spot and high cutting precision产品亮点:可兼容振镜和聚焦头两种裂片方式Compatible with galvo and focusing head兼容多款国内外激光器型号,可添加CCD定位等功能模块Compatible with a variety of domestic and overseas laser modelsOptional customized CCD solution and other functional modules can be added高速XY运动平台,大程度提升加工速度High speed XY platform ensures stability under high speed processing可切割有油墨与镀膜蓝宝石Minimum ink offset when cutting Sapphire with deco实现无锥度切割,边缘光滑,崩边少Realize no taper cutting, smooth edge and minimized chipping性能参数:应用领域:0.3mm-5mm厚度光玻璃,手机盖板、手表盖板、玻璃logo的切割倒角工艺0.3mm-2mm sapphire, phone cover, watch cover, camera protective glass, optic protective cover filamentation and separation
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