高精度凹坑仪

 Independent speed adjustment for specimen and wheel rotation
样品和砂轮分别转速可调
 Automatic zeroing process
自动零位调整
 A 40X optical microscope
40倍光学显微镜
 Automatic termination
减薄到设定厚度时自动终止
 Continuous readout of specimen thickness
样品厚度连续可读
 Grinding wheels provided in stainless steel, phosphor bronze,
and micarta
提供不锈钢,铜,木质等砂轮
 208mmW x 165mmH x 343mmD
 16KG
 110/220 VAC, 50/60Hz
 375W

The Model 200 Dimpling Grinder is a mechanical thinning instrument designed for the reproducible preparation of quality TEM specimens. The grinding control mechanism predetermines the rate at which material is removed, while microprocessor-based control circuitry automatically terminates the grinding process when a desired specimen thickness is achieved. The Model 200 features continuous specimen thickness monitoring on an alphanumeric display with an accuracy of better than one micron. A 40X optical microscope facilitates precise specimen positioning as well as in-situ specimen observation. The specimen is illuminated by both transmitted and reflected light.
把超声切割后的样品磨出低角度大面积凹坑.数字式的控制系统可实时显示样品的厚度精度达到1um.砂轮及样品的旋转分别控制,程序控制减薄到设定厚度时自动停止.提供一个40倍的放大镜可用于观察透射光及反射光样品.