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heliInspectTM H3 - 3D Measurement Head
The new 3D vision module H3 from Heliotis brings superior 3D metrology to the production floor. Equipped with Heliotis’ latest 3D sensor heliSenseTM S3, this compact measurement module provides sub-micrometer surface analysis as well as true tomographic volume data.
The instrument utilizes Heliotis’ proven parallel Optical Coherence Tomography principle and offers unmatched scan rates. Fast acquisition rates and a special design of the interferometer render vibration isolation obsolete. The 3D vision module is engineered for high throughput and rough environments. It is manufactured in Switzerland for long lasting reliability. |
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The new 3D vision module can be mounted on most motorized positioning systems. Pre-qualified stages are also available from Heliotis and partners. Choices include
resolution 1um (standard), 100 nm (optional)
travel range from 40 mm to 1 m
software interfaces: C++, LabViewTM, Python
If desired, our engineering team will design and deliver a turn-key system that matches your application
Specifications
Measurement Module
3D sensor | proprietary smart pixel sensor heliSenseTM S3 with in-pixel signal processing of up to 1 million 2D-slices per second | ||
| 2D mode | live-view for navigation on sample (optional) | ||
| light source | standard: Superluminescent Light Emitting Diode | ||
| field of view | 0.45 x 0.47 mm | 1.4 x 1.45 mm | 2.8 x 2.9 mm |
| numerical aperture | 0.4 | 0.17 | 0.11 |
| working distance | 2.8 mm | 18.1 mm | 22.7 mm |
| vertical resolution | 0.5 μm, 50 nm (optional) | ||
| vertical scan speed | up to 50 mm per second | ||
| lateral resolution | 1.6 μm | 5 μm | 10 μm |
| reflectivity of sample | < 0.1 % to 100 % | ||
Scan Module
Z-axis | 80 mm vertical scan range |
Software
heliCommander | configuration and control of the system |
| Application Programming Interface | C++, Python and LabView 2012, macros (ImageJ) (scanner control, 3D-camera configuration and readout, data processing algorithms |
Applications
Providing fast and robust 3D-metrological data, Heliotis' unique technology is capable of bringing innovations to many different fields - limited only by your imagination.
To explore what our technology can do for you, please send us a short description of your measurement task. We will gladly perform test measurements of your samples free of charge.
Electronics, Technical Surfaces
CSPs and micro-BGAs continue to increase the packaging density of PCBs, but the ever shrinking pad sizes make it harder to ensure the reliability of the solder joints. Advanced 3D-profiling provides reliable data on solder height and solder volume to fine-tune the screen printer configuration, monitor process statistics for SPC and increase First Pass Yield.
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Micro-mechanics, Micro-optics
Miniaturization allows for innovative products with superior performance at reduced costs. Devices such as MEMS and micro-optics make use of production techniques originally developed for integrated circuits. With dimensions down to the micro-meter range, conventional inspection systems are no longer appropriate - especially where three dimensional accuracy needs to be verified.
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Life Science
The M3 delivers quantitative topological and tomographic data of biological samples in high resolution. Its non-invasive and non-contact measurement principle p-OCT works with non-ionizing visible or near infrared light.
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Forensics & Security Solutions
Fnology is used for comparing cartridge cases from crime scenes, demonstrating superior performance over legacy 2D systems. Furthermore, the detailed 3D-metrology is instrumental in detecting counterfeits and forgery. |
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