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—Laser Sapphire Full-Cutting Machine
1．Description（描述）
This machine is a laser sapphire glass full-cutting machine to be processed with a precise laser beam in the field of camera lens and touch ID, and the touch windows of Mobile Phone/PMP, Tablet PC, etc Flat Display products.
This laser sapphire full-cutting machine has the best method with high speed and accuracy, especially the small chip for outline and hole/slot cutting, comparing to the other processing methods.
This laser full-cutting has many merits of high efficiency, high throughput, less utilizing fee with less components exchange.
2．Feature（特色）
? Apply full-cutting for every sapphire glass wafer worldwide.
? High quality cut various shapes, small chipping size by no touch processing.
? Low machine maintenance and utilizing fee by no tool changes, lubricating oils.
? Short preparation time for the machine operation and simple operation.
? A IR fiber laser with Min. 30μm spot size is used, with considerably stable beam quality.
? The machine is equipped with various functions involving the exclusive software and
? controller to be effectively processing any contours cutting.
? The machine has high positioning accuracy at 1μm and high speed processing at 100mm/sec.
? The machine is easy accessible for quick trouble-shooting, since it is composed with all standard components.
? The machine has exhaust, vacuum, fixture, etc, various equipments for the micro laser processing and sapphire/glass positioning without any scratches.
? The automatic laser full-cutting machine can be supplied with the proper jig/fixture to be fixed by any various mother sapphire glass wafer size, and loading/unloading tools of robot mechanism and CCD vision system as an option of high throughput.
3．Configuration（配置）
? Standard machine; Manual loading/unloading
-Automatic loading/unloading system (Option)
-CCD vision system (Option)
? Standard Sapphire Glass Wafer Size：4inch
? Sapphire glass thickness：From 0.15mm
4．Specification（规格）
Laser resonator | X-Y axis movement |
Laser type：Fiber laser Laser power：150W Laser peak power：Max. 1.5KW Laser sport beam size：Min. 30um Laser beam mode：TEM00 Laser wavelength：1070nm Pulse width：0.2ms Q- Switch Machine environment -Temperature：15-30 Deg. C -Humidity：30%-70% | Linear stage Working area：150 X 200mm Transfer speed：100mm/sec Accuracy：+/-1um Repeated accuracy：+/-1um
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Z axis movement | |
Ball Screw & LM Guide Stroke：60mm Accuracy：+/-10um |
