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The cleaving tool is designed for cleaving wafers into thin strips/bars in a UHV process chamber. The cleaving tool mounts on a single flange of the process chamber. The tool cleaves wafers into 15mm long by 1mm wide bars; other dimensions are available to fit your system needs. The thin bars are stacked, rotated and placed on a deposition block. The deposition block can then be transferred to a deposition chamber for facet coating of the two cleaved edges or for other deposition processes. The entire process is performed under ultra-high vacuum conditions. SVTA will assist you to add the cleaving tool to your existing system configuration.
激光芯片解离镀膜机,又称超高真空裂片钝化系统。它是通过在10^-10Torr的真空度下,对激光芯片进行切割,使芯片解理成一个一个分离Bar条。然后,依然是在此真空下,直接对Bar的腔面经行镀膜钝化。
通过如此工艺加工的后的Bar条,寿命提高了100-10000倍不等。烧蚀功率也大幅提高。
欢迎来电咨询。
用户单位 | 采购时间 |
---|---|
江苏无锡某厂 | 2011-10-10 |
中科院北京半导体所 | 2007-01-12 |
中国工程物理研究院 | 2012-01-22 |
长春理工大学 | 2012-01-11 |
北京半导体所 | 2011-11-01 |
河北中电13所 | 2011-07-24 |
odyne HDL-64E Lidar,即Velodyne公司64线激光雷达是目前世界上最先进,体积最小,单位能量密度最高,采集数据最丰富的专业激光传感器。 集成了64束激光发射器和64个激光接收器。360度的旋转,最高15Hz的转动频率,每周4000个点的采集频率,让64E Lidar激光雷达当之无愧的成为当今世界不予伦比的激光雷达王者。 更多产品及资料,请关注誉荣官网:www.famouset.com
Velodyne在2009年为了适应科研界对激光雷达体积更小,精度更高,速度更快的普遍要求,开发了32E激光雷达产品。此款产品备受瞩目,目前成为Velodyne LiDAR中最为热销款产品。被广泛应用于自主制导探测,人工智能控制,机器人等领域。 更多产品及资料,请关注誉荣官网:www.famouset.com
Velodyne has developed and produced a High Definition Lidar (HDL) sensor designed to satisfy the demands for autonomous vehicle navigation, stationary and mobile surveying, mapping, industrial use and other applications. The Velodyne HDL unit provides 360- degree azimuth field of view and 26.5-degree elevation field of view, up to 15 Hz frame refresh rate, and a rich point cloud populated at a rate of one million points per second. This White Paper first explores various technologies for 3-D lidar sensing, then discusses the design principals and construction of the Velodyne HDL-64E lidar sensor. 更多产品及资料,请关注誉荣官网:www.famouset.com
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