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当前位置: 瀚宇 > 激光产品 > KLT-LSC激光蓝宝石全切割机
  • KLT-LSC激光蓝宝石全切割机
  • KLT-LSC激光蓝宝石全切割机
  • KLT-LSC激光蓝宝石全切割机
  • KLT-LSC激光蓝宝石全切割机

KLT-LSC激光蓝宝石全切割机

品牌: 德东科技
产地: 韩国
型号: KLT-LSC
样本: 下载
报价: 面议

核心参数

组成要素: 固体激光器产品及设备

产品介绍

KLT-LSC激光蓝宝石全切割机

Laser Sapphire Full-Cutting Machine

1Description(描述)

This machine is a laser sapphire glass full-cutting machine to be processed with a precise laser beam in the field of camera lens and touch ID, and the touch windows of Mobile Phone/PMP, Tablet PC, etc Flat Display products.

This laser sapphire full-cutting machine has the best method with high speed and accuracy, especially the small chip for outline and hole/slot cutting, comparing to the other processing methods.

This laser full-cutting has many merits of high efficiency, high throughput, less utilizing fee with less components exchange.

2Feature(特色)

?  Apply full-cutting for every sapphire glass wafer worldwide.

?  High quality cut various shapes, small chipping size by no touch processing.

?  Low machine maintenance and utilizing fee by no tool changes, lubricating oils.

?  Short preparation time for the machine operation and simple operation.

?  A IR fiber laser with Min. 30μm spot size is used, with considerably stable beam quality.

?  The machine is equipped with various functions involving the exclusive software and

?  controller to be effectively processing any contours cutting.

?  The machine has high positioning accuracy at 1μm and high speed processing at 100mm/sec.

?  The machine is easy accessible for quick trouble-shooting, since it is composed with all standard components.

?  The machine has exhaust, vacuum, fixture, etc, various equipments for the micro laser processing and sapphire/glass positioning without any scratches.

?  The automatic laser full-cutting machine can be supplied with the proper jig/fixture to be fixed by any various mother sapphire glass wafer size, and loading/unloading tools of robot mechanism and CCD vision system as an option of high throughput.

3Configuration(配置)

?  Standard machine; Manual loading/unloading

-Automatic loading/unloading system (Option)

-CCD vision system (Option)

?  Standard Sapphire Glass Wafer Size4inch

?  Sapphire glass thicknessFrom 0.15mm

4Specification规格)

    Laser resonator

X-Y axis movement

    Laser typeFiber laser

    Laser power150W

    Laser peak powerMax. 1.5KW

    Laser sport beam sizeMin. 30um

    Laser beam modeTEM00

    Laser wavelength1070nm

    Pulse width0.2ms

    Q- Switch

    Machine environment

-Temperature15-30 Deg. C

-Humidity30%-70%

    Linear stage

    Working area150 X 200mm

    Transfer speed100mm/sec

    Accuracy+/-1um

    Repeated accuracy+/-1um

 

Z axis movement

    Ball Screw & LM Guide

    Stroke60mm

    Accuracy+/-10um

 

工商信息

企业名称

瀚宇科技(香港)有限公司

企业信息已认证

企业类型

信用代码

成立日期

2006-08-24

注册资本

395

经营范围

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公司名称: 瀚宇科技(香港)有限公司北京办事处

公司地址: 北京市大兴区旧忠路10号院10号楼1707 联系人: 韩先生 邮编: 100076

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