CMP 材料

Our wafer backside grinding tools positively impact your total
cost of ownership through:
• Longer wheel life
• Lack of nitride passivation
• Extremely low depth of sub-surface damage
• Strong, premium quality diamond
• High production up-time
• Extremely high die strength
• Reduced wheel dressing
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 
ABSTRACT
The effects of tightly controlled diamond size and diamond shape on the performance of pad conditioning disks were
investigated. Pad removal rate performance of conditioning disks was demonstrated on Rodel IC1000 pads and Thomas
West polyurethane pads.
Results indicate that by manipulating the shape of diamonds used on pad conditioning disks1, the polishing pad removal
rate can be varied by more than 400% on a Rodel IC1000 pad. The impact of tightly controlling diamond size distribution
on polishing pad removal rate varies with mean diamond size. By correctly controlling the diamond shape and size
distribution, the conditioning disk2 and polishing pad life can be increased.
Data indicates that a similar relationship between diamond shape and pad removal rate exists on Thomas West polishing
pads. Manipulating diamond shape on the conditioning disk allows the polishing pad removal rate to be controlled.
INTRODUCTION
Several diamond variables were investigated to determine their effects on PRR (polishing pad removal rate), RAS
(Relative Abrasive Sharpness3 ), and conditioning disk life. The variables investigated were diamond concentration, diamond
size distribution, diamond shape, and diamond mesh size.
The effects of the diamond variables are demonstrated on both Rodel IC1000 and Thomas West 813-C239G-24 polishing
pads. Selected disks were subjected to extended PRR tests in oxide slurry to demonstrate the effects of tight sized, tight
shaped abrasive on diamond conditioning disk life. 
EXPERIMENTS
The diamond used in the experiments was characterized by size distribution and shape. Diamond sizing was performed
according to ANSI B74.16-2002 using precision sieves. Diamond shaping was performed on a vibratory shaping table.
The PRR tests were performed on a lab-scale conditioning machine. See Table 1 for test parameters. The conditioning
disk platforms were standard Mirra® universal mounts. All conditioning pads were 8.25” in diameter. RAS measurements
were made using proprietary Abrasive Technology test equipment.

CMP PAD CONDITIONING
Abrasive Technology’s pad conditioning disks operate on all major CMP equipment platforms around the world in
oxide (ILD, STI, POLY, BPSG) and metal (W, Cu, Ta, Al) processes. Disks are available in both magnetic and non-magnetic
grades of stainless steel in a wide variety of front surface configurations. The ability to dial in customers’ CMP process
requirements allows ATI to deliver conditioning solutions in the shortest possible time.
ALSO AVAILABLE: DISKS FOR 300 MM SYSTEMSCMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料CMP 材料