■ Auto Exposure / Alignment System ■ 2~6 inch wafer process ■ Interface between Aligner and Robot : RS-232C ■ Auto Loading and Unloading Using Double Robot Arm ■ Auto-Alignment with Vision System ■ Pre-Alignment and Automatic Positioning ■ Anti-Vibration Table ■ Dual CCD Auto zoom Microscope ? Variable Magnification : Max. 1400x ■ 17inch LCD touch monitor ■ Wedge Error Compensation ■ Throughput :Alignment : 120WPH PSS, First layer : 170WPH
Item
Specification
Exposure System
Lamp Power
350W UV Lamp(OSRAM)
Resolution
0.8um (Vacuum contact)
Beam Uniformity
≤ ± 5% (6inch standard)
Intensity
20~25mW/cm2:350~450nm
Adjustable Exposure Time
0.1 to 999.9 sec
Alignment System
Alignment Accuracy
1um
Alignment Gap
20 to 200um
Pre-Alignment Accuracy
± 50um
Process Mode
Vacuum, Hard, Soft Contact and Proximity
*Proximity Gap is 20um to 200um
Proximity Adjustment
adjustable 1 micron increments Program Control System
Throughput
>120 wafer/hour (Auto alignment) 170 wafer/hour (PSS, First layer)