等离子体去胶机（高性价比）

品牌：

产地：韩国

型号： EURA-200

报价：面议

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产品介绍

仪器应用：
Isotropic dry etching of polymer (photo resist)
Cleaning of silicon (or glass) wafer surface
Removal of native oxide on wafer

技术参数：
Sample size & throughput : 4 ~ 8inch, Single wafer
RF power : 600W @13.56MHz, Auto matching control
Substrate chuck : Heating or Cooling available (selectable)
Process gas : O2, CF4 ,Ar, N2
Gas supply method : Showerhead type
Ultimate pressure : ≤ 5×10-3Torr
Vacuum pump : Rotary pump
Process control : Auto process control (PLC)

常用工艺参数：
Photoresist Etch

gas	100% O₂
operating pressure	100 millitorr
power level	100 watts
etch rate	997 angstroms/min
uniformity	+/- 5%

Nitride Etch

gas	95% CF₄ / 5% O₂
operating pressure	100 millitorr
power level	100 watts
etch rate	450 angstroms/min
uniformity	+/- 5%

BiPolar Silicon Glass (BPSG) Etch

gas	95% CF₄ / 5% O₂
operating pressure	100 millitorr
power level	100 watts
etch rate	520 angstroms/min
uniformity	+/- 5%

PolySilicon Glass (PSG) Etch

gas	95% CF₄ / 5% O₂
operating pressure	100 millitorr
power level	100 watts
etch rate	450 angstroms/min
uniformity	+/- 5%

Oxide Etch (SiO₂)

gas	95% CF₄ / 5% O₂
operating pressure	100 millitorr
power level	100 watts
etch rate	200 angstroms/min
uniformity	+/- 10%

Aluminum Etch*

gas	80% BCl₃ /20% Cl₂
operating pressure	150 millitorr
power level	150 watts
etch rate	200 angstroms/min
uniformity	+/- 5%