IsoMet™ 低速精密切割机

对于小型紧固件的金相评估，可以在略微偏离螺纹中心轴的情况下进行切割，或在预镶嵌后通过机械研磨到接近其螺纹中心轴的位置。切割小紧固件时，可以使用砂轮切割机，用较薄的切割片对其进行纵向切割或者使用精密切割设备以确保小切口损耗，切口可以更靠近紧固件中心轴。将紧固件稍稍偏离中心进行切割，为后续研磨和抛光阶段留下足够的材料。

This brochure outlines some challenges that the medical community faces when preparing specimens for analysis. Solutions are met in a variety of ways using Buehler expertise, specialty equipment, consumables and services in the medical electronics failure analysis, histology and fiber optics markets. Our educational programs offer in-depth knowledge, support and demonstration of equipment and consumables.

Microelectronics, Part I: Cutting, Mounting Written by: Scott Holt,Applications Engineer,Buehler Editor:George Vander VoortDirector, Research and Technology, Buehler Introduction For most microelectronic devices and packages, direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive inspection are employed. In order to produce a cross section, many of the techniques used in the metals industry have been borrowed; to a large degree, with success. However, the philosophy and logic for choosing a particular method of cutting, mounting, and abrasive preparation has often been lost in the process. This is of extreme significance because the needs of the microelectronics industry vary greatly from those of the metals industry. Issues such as feature size, specific area cross sectioning, and the ability to prepare a variety of materials with different mechanical properties within a single plane of polish require an understanding of basic abrasive processes so that appropriate sectioning methods might be developed. This issue of TECH-NOTES is the first half of a two part effort to summarize some of the basic concepts involved in proper preparation of microelectronic materials. We will discuss some simple guidelines which the microelectronic materials analyst might draw upon in the development of better preparation techniques. In particular, this issue will cover the variables involved in cutting and mounting of microelectronic materials, and summarize some of the technique and consumable choices that must be considered in order to achieve quality results. The next microelectronics issue of TECH-NOTES will continue with the abrasive processes of grinding and polishing these materials.