IsoMet™ 低速精密切割机
IsoMet™ 低速精密切割机
IsoMet™ 低速精密切割机
IsoMet™ 低速精密切割机
IsoMet™ 低速精密切割机
IsoMet™ 低速精密切割机

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IsoMet™ Low Speed Cutter

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美洲

  • 金牌
  • 第22年
  • 一般经销商
  • 营业执照已审核
核心参数

仪器种类: 精密切割机

产地类别: 进口

标乐 IsoMet™ 低速精密切割机


产品简介:

IsoMet 低速精密切割机是美国标乐专为各种材料的低变形切割而设计的低速精密切割机。采用了先进成熟的低变形切割技术,其切口损失率低,可切割出几乎没有任何损伤和变形的截面;配有种类齐全的夹具和法兰,可夹持各种不同外形和组态的样品;精确的千分尺调节器,用于在切割前调整样品位置,使样品定位简便精确;这款切割机几乎可以切割任何材料,包括:脆性/韧性金属,复合材料,陶瓷,塑料,层压制品,电子器件和生物材料等,是现代实验室最理想的精密切割工具。


出色的易碎试样切割质量

 · 重力进给切割力可减少脆弱试样的变形

 · 为各种各样的材料提供不同的切割质量

 · 转速范围为0-300RPM 的切割机可以切割几乎任何材料,包括:脆性/韧性金属、复合材料、陶瓷、层压制品、塑料、电子器件以及生物材料。


精确的切割定位控制

 · 通过一个自动千分尺可使切割精度达到±0.0001in [±5μm]

 · 多功能的样品架实现所有需要的切口形状和配置。


   

IsoMet LS 低速精密切割机产品参数
频率通用
电压115,   220
相数1
切割容量1.50[in],   38.00[mm]
切割片直径5.00[in]
控制按钮
切割类型重力进给直切
编程不可编程
连续切割不适用
切割片直径127[mm]
转速   @60Hz:   300


如需了解更多有关 SimpliVac的技术参数、附件及耗材信息欢迎咨询! 


关于标乐(Buehler)

    标乐(Buehler)是材料制备、图像分析和硬度测试所用仪器、附件、耗材和相关技术的出色供应商。标乐(Buehler)产品涵盖众多行业,包括金属、汽车、航空航天、电子、医疗、能源等。

    标乐公司与 ASM International(美国材料信息学会)、American Society for Testing and Materials(美国材料和测试协会)和 International Metallographic Society(国际金相学学会)等联盟机构保持着行业合作伙伴传统。标乐公司自 1946 年起便赞助 ASM Francis F. Lucas Metallographic Award 金相奖,并赞助了 International Metallographic Society(国际金相学学会)的 Pierre Jacquet Award 奖项,为材料科学的研究做出贡献。

    标乐(Buehler)隶属于美国ITW集团(伊利诺伊工具公司),总部坐落在美国伊利诺伊州莱克布拉夫市。ITW是一家美国财富200强企业,在全球从事增值耗材、特种设备的工业产品制造并提供相关服务。 标乐公司于1936年建立,是最早为材料分析行业制造科学设备和材料的厂商。2011年标乐和威尔逊硬度计合并,提供了更全的材料制备和分析检测设备。标乐现已在9个国家成立办事处、在100多个国家设立销售网点并拥有超过45个标乐解决方案中心。


- 标乐中国 -

依工测试测量仪器(上海)有限公司

标乐(Buehler)&威尔逊(Wilson)厂家


  • 对于小型紧固件的金相评估,可以在略微偏离螺纹中心轴的情况下进行切割,或在预镶嵌后通过机械研磨到接近其螺纹中心轴的位置。切割小紧固件时,可以使用砂轮切割机,用较薄的切割片对其进行纵向切割或者使用精密切割设备以确保小切口损耗,切口可以更靠近紧固件中心轴。将紧固件稍稍偏离中心进行切割,为后续研磨和抛光阶段留下足够的材料。

    汽车及零部件 2022-07-22

  • Microelectronics, Part I: Cutting, Mounting Written by: Scott Holt,Applications Engineer,Buehler Editor:George Vander VoortDirector, Research and Technology, Buehler Introduction For most microelectronic devices and packages, direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive inspection are employed. In order to produce a cross section, many of the techniques used in the metals industry have been borrowed; to a large degree, with success. However, the philosophy and logic for choosing a particular method of cutting, mounting, and abrasive preparation has often been lost in the process. This is of extreme significance because the needs of the microelectronics industry vary greatly from those of the metals industry. Issues such as feature size, specific area cross sectioning, and the ability to prepare a variety of materials with different mechanical properties within a single plane of polish require an understanding of basic abrasive processes so that appropriate sectioning methods might be developed. This issue of TECH-NOTES is the first half of a two part effort to summarize some of the basic concepts involved in proper preparation of microelectronic materials. We will discuss some simple guidelines which the microelectronic materials analyst might draw upon in the development of better preparation techniques. In particular, this issue will cover the variables involved in cutting and mounting of microelectronic materials, and summarize some of the technique and consumable choices that must be considered in order to achieve quality results. The next microelectronics issue of TECH-NOTES will continue with the abrasive processes of grinding and polishing these materials.

    电子/电气 2007-01-19

  • Microelectronics, Part I: Cutting, Mounting Written by: Scott Holt,Applications Engineer,Buehler Editor:George Vander VoortDirector, Research and Technology, Buehler Introduction For most microelectronic devices and packages, direct microscopic observation of a cross section is an important means of inspecting a particular defect. The creation of a cross section, as a destructive measure, is often used in the microelectronics lab as a decisive and final inspection tool after all other economical means of nondestructive inspection are employed. In order to produce a cross section, many of the techniques used in the metals industry have been borrowed; to a large degree, with success. However, the philosophy and logic for choosing a particular method of cutting, mounting, and abrasive preparation has often been lost in the process. This is of extreme significance because the needs of the microelectronics industry vary greatly from those of the metals industry. Issues such as feature size, specific area cross sectioning, and the ability to prepare a variety of materials with different mechanical properties within a single plane of polish require an understanding of basic abrasive processes so that appropriate sectioning methods might be developed. This issue of TECH-NOTES is the first half of a two part effort to summarize some of the basic concepts involved in proper preparation of microelectronic materials. We will discuss some simple guidelines which the microelectronic materials analyst might draw upon in the development of better preparation techniques. In particular, this issue will cover the variables involved in cutting and mounting of microelectronic materials, and summarize some of the technique and consumable choices that must be considered in order to achieve quality results. The next microelectronics issue of TECH-NOTES will continue with the abrasive processes of grinding and polishing these materials.

    电子/电气 2007-01-19

  • 对于小型紧固件的金相评估,可以在略微偏离螺纹中心轴的情况下进行切割,或在预镶嵌后通过机械研磨到接近其螺纹中心轴的位置。切割小紧固件时,可以使用砂轮切割机,用较薄的切割片对其进行纵向切割或者使用精密切割设备以确保小切口损耗,切口可以更靠近紧固件中心轴。将紧固件稍稍偏离中心进行切割,为后续研磨和抛光阶段留下足够的材料。

    汽车及零部件 2022-07-22

售后服务承诺

保修期: 1年

是否可延长保修期:

现场技术咨询:

免费培训: 面议

免费仪器保养: 面议

保内维修承诺: 面议

报修承诺: 面议

  • IsoMet® Low Speed 是一款低速精密切割机, 专门用于切割多种材料, 并保证产生的变形最小。 其具有切割材料损耗小及可夹持不同大小形状试样的特点, 几乎适用于所有实验室材料, 包括脆韧性金属、 复合材料、 水泥、 塑料、 薄片、 电子和生物材料。

    14878MB 2022-07-22
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IsoMet™ 低速精密切割机信息由美国标乐为您提供,如您想了解更多关于IsoMet™ 低速精密切割机报价、型号、参数等信息,标乐客服电话:400-860-5168转0532,欢迎来电或留言咨询。
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