简介:The SPI Supplies Plasma Prep Reactive Ion Etcher (RIE)
uses a chemically reactive anisotropic plasma to etch and
remove materials from package devices, wafers, and other
substrates where a directional field is needed.简介:The SPI Supplies Plasma Prep Reactive Ion Etcher (RIE)
uses a chemically reactive anisotropic plasma to etch and
remove materials from package devices, wafers, and other
substrates where a directional field is needed. In failure
analysis labs, the use of wet etching for these samples is not
only dangerous, in many cases it causes undercutting due to
the isotropy of the etch. The Plasma Prep Reactive Ion Etcher
uses dry etching to create an anisotropic etch—meaning that the etch is uni-directional详细>