简介:VACUUM IMPREGNATION EQUIPMENT I
1. Recommended when very small through-holes (<0.032" diameter) need to be filled
2. Should also be used with thick PCB’s (>6 layers)
VACUUM IMPREGNATION EQUIPMENT I
3. Air is removed简介:VACUUM IMPREGNATION EQUIPMENT I
1. Recommended when very small through-holes (<0.032" diameter) need to be filled
2. Should also be used with thick PCB’s (>6 layers)
VACUUM IMPREGNATION EQUIPMENT I
3. Air is removed from hole so that edges from rounding
4. Epoxy mounting compounds perform the best under impregnation
Buehler’s Epoxide has proven to work the best
Acrylics such as SAMPL-KWICK do not work well in a vacuum
SAMPL-KWICK in fact, has a tendency to boil
1. Mounting compound is poured into mold in the vacuum
The patented Vacuum Chamber
Pouring in the mold outside the vacuum and then placing it inside will not remove the bubbles
No. 20-1382-160 VACUUM IMPREGNATION EQUIPMENT I, with high strength plastic vacuum chamber, built-in synchronous motor and rotating turn table, pouring mechanism, vacuum gauge and hose, filtering flask, glass tubing, rubber stopper, 100 graduated paper cups, 12 SAMPL-KUPS, 100 vacuum table liners, Drierite dehydrating agent and vacuum pump for 115V/60Hz/1 phase.
No. 20-1382-250 VACUUM IMPREGNATION EQUIPMENT I, same as 20-1382-160 but for 220V/50Hz/1 phase operation.
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