简介:Copper ion (Cu2+) contained in the etching solution is quantified using chelatometric titration
method based on chemical reaction shown below. The AQUACOUNTER’s COM series Titrator with
Photometric unit is provided wit简介:Copper ion (Cu2+) contained in the etching solution is quantified using chelatometric titration
method based on chemical reaction shown below. The AQUACOUNTER’s COM series Titrator with
Photometric unit is provided with an optical probe and optimum filter.
The effect of acidic compounds contained in etching treatment solution becomes deteriorated with
repeated use in process. In this application, the sample may contain mainly the following two acidic
compounds: sulfuric acid and ammonium hydrogen fluoride, three inflection points will appear in the
measurement of used etching solution. By linking three condition files, a sequential titration can be
performed to detect all end points.
Hydrogen peroxide is contained in etching solutions as the surface treatment solution for copper
foil on printed circuit boards, and it acts as oxidant or reductant depending on the compound it
reacts with. The amount of the hydrogen peroxide can be determined by a typical redox titration
with potassium permanganate titrant.详细>